Semiconductor device and method for fabricating the same

ABSTRACT

A method for fabricating a three dimensional type capacitor is provided. The method includes forming a first insulation layer including first contact layers over a substrate, forming a second insulation layer over the first insulation layer, forming second contact layers by using a material having an etch selectivity different from the first contact layers such that the second contact layers are connected with the first contact layers within the second insulation layer, forming an etch stop layer over the second insulation layer and the second contact layers, forming a third insulation layer over the etch stop layer, etching the third insulation layer and the etch stop layer to form first contact holes exposing the second contact layers, etching the exposed second contact layers to form second contact holes exposing the first contact holes, and forming bottom electrodes over the inner surface of the second contact holes.

FIELD OF THE INVENTION

The present invention relates to a method for fabricating asemiconductor device; and more particularly, to a method for fabricatinga three dimensional type capacitor to secure a high capacitance byincreasing an effective surface area of the capacitor.

DESCRIPTION OF RELATED ARTS

As semiconductor devices have become highly integrated, there has been agreat effort to secure a higher capacitance in a same layout area. Sincea capacitance of a capacitor is proportionate to a permittivity (□) andan effective surface area of an electrode, but the capacitance of thecapacitor is inversely proportionate to a distance between electrodes,up to now, it has been tried to secure a surface area of an electrodefor storing electric charges or minimize a distance between electrodesby making a dielectric substance with a thin film.

However, making the dielectric substance with the thin film provides alimitation which a leakage current increases and accordingly, acapacitor structure has been formed in a three dimensional type such asa planar stack type, a concave type, or a cylinder type, therebyincreasing an effective surface area of the capacitor. Meanwhile, alongwith applying the three dimensional type capacitor, a ferroelectricsubstance made of a thin film and having a high permittivity has beenused.

FIGS. 1A to 1F are cross-sectional views illustrating a conventionalmethod for fabricating a three dimensional capacitor.

First, as shown in FIG. 1A, a first insulation layer 10 in which aplurality of first contact layers 11 are interposed in the firstinsulation layer 10 is formed over a substrate (not shown) provided witha predetermined semiconductor structure (not shown).

Next, a second insulation layer 12 is deposited over the firstinsulation layer 10 including the first contact layers 11. Afterwards, aplurality of bit lines 13 are formed over the second insulation layer12. At this time, a plurality of capping layers 14 are formed over thebit lines 13 to protect the bit lines 13, and a plurality of spacers 15are formed on sidewalls of the bit lines 13.

Next, a third insulation layer 16 is deposited over the above resultingstructure and then, the third insulation layer 16, and the secondinsulation layer 12 are etched, thereby forming a plurality of firstcontact holes (not shown) exposing the first contact layers 11.

Next, a plurality of second contact layers 17 burying the first contactholes are formed.

Next, as shown in FIG. 1B, an etch stop layer 18 is deposited over thethird insulation layer 16 including the second contact layers 17.

Next, as shown in FIG. 1C, a fourth insulation layer 19 is formed overthe etch stop layer 18 and afterwards, a hard mask 20 is deposited overthe fourth insulation layer 19.

Next, as shown in FIG. 1D, a predetermined photoresist pattern 21 isformed over the hard mask 20. Then, an etching process 22 is performedby using the photoresist pattern 21 as an etch mask, thereby etching thehard mask 20 and the fourth insulation layer 19. At this time, theetching process 22 is stopped over a certain portion of the etch stoplayer 18 once and thus, a plurality of second contact holes 23 exposingthe certain portions of the etch stop layer 18 can be formed.

Next, as shown in FIG. 1E, a stripping process is performed, therebyremoving the photoresist pattern 21 (refer to FIG. 1D) and a plasmaetching process is performed, thereby removing the hard mask 20 (referto FIG. 1D).

Next, the etch stop layer 18 exposed beneath bottom portions of thesecond contact holes 23 (refer to FIG. 1D) is etched, thereby forming aplurality of third contact holes 24 exposing the second contact layers17.

Next, as shown in FIG. 1F, a bottom electrode 25 is formed over an innersurface of each of the third contact holes 24 (refer to FIG. 1E), and adielectric layer 26 is formed over a height difference of the aboveresulting structure. Afterwards, a top electrode 27 is formed on thedielectric layer 26 to fill the third contact holes 24.

FIG. 2 is a microscopic image of scanning electron microscopy (SEM)illustrating the capacitor of the semiconductor device formed throughsteps shown in FIGS. 1A to 1F.

However, there is a limitation in increasing an effective surface areaif the three dimensional type capacitor is formed through the abovedescribed steps. Accordingly, it may be difficult to secure acapacitance required by the highly integrated semiconductor device.

SUMMARY OF THE INVENTION

It is, therefore, an object of the present invention to provide a methodfor fabricating a semiconductor device capable of securing a capacitancerequired by a highly integrated semiconductor device by increasing aneffective surface area of a capacitor.

In accordance with one aspect of the present invention, there isprovided a method for fabricating a semiconductor device, including:forming a first insulation layer including a plurality of first contactlayers over a substrate; forming a second insulation layer over thefirst insulation layer; forming a plurality of second contact layers byusing a material having an etch selectivity different from the firstcontact layers such that the second contact layers are connected withthe first contact layers within the second insulation layer; forming anetch stop layer over the second insulation layer and the second contactlayers; forming a third insulation layer over the etch stop layer;etching the third insulation layer and the etch stop layer to form aplurality of first contact holes exposing the second contact layers;etching the exposed second contact layers to form a plurality of secondcontact holes exposing the first contact holes; and forming bottomelectrodes over the inner surface of the second contact holes.

In accordance with another aspect of the present invention, there isprovided a method for fabricating a semiconductor device, including:forming a first stack structure over a substrate including a pluralityof first contact layers; forming a plurality of first openings insidethe first stack structure such that the first openings expose the firstcontact layers; forming a plurality of second contact layers in thefirst openings; forming a second stack structure over the second contactlayers and the first stacked structure; etching the second stackstructure using a pattern as a mask to expose the second contact layers;etching the exposed second contact layers to form second openingsexposing the first contact layers; and forming bottom electrodes overthe inner surface of the second openings.

In accordance with further aspect of the present invention, there isprovided a semiconductor device, including: a first stack structure overa substrate including a plurality of first contact layers; a pluralityof first openings in the stack structure such that the first openingsexpose the first contact layers; second contact layers formed in thefirst openings; a second stack structure over the second contact layersand the first stack structure; a plurality of second openings by etchingthe second stack structure and the second contact layers using a patternas a mask; and a plurality of bottom electrodes over the inner surfaceof the second openings.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects and features of the present invention willbecome better understood with respect to the following description ofthe preferred embodiments given in conjunction with the accompanyingdrawings, in which:

FIGS. 1A to 1F are cross-sectional views illustrating a conventionalmethod for fabricating a three dimensional type capacitor;

FIG. 2 is a micrographic image of scanning electron microscopy (SEM)illustrating the three dimensional type capacitor formed through FIGS.1A to 1F;

FIGS. 3A to 3F are cross-sectional views illustrating a threedimensional type capacitor in accordance with a first embodiment of thepresent invention;

FIG. 4 is a micrographic image of SEM illustrating the three dimensionaltype capacitor in accordance with the first embodiment of the presentinvention; and

FIGS. 5A to 5F are cross-sectional views illustrating a threedimensional type capacitor in accordance with a second embodiment of thepresent invention.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, detailed descriptions on certain embodiments of the presentinvention will be provided with reference to the accompanying drawings.

FIGS. 3A to 3F are cross-sectional views illustrating a method forfabricating a three dimensional type capacitor in accordance with afirst embodiment of the present invention. Herein, among referencenumerals illustrated in FIGS. 3A to 3F, the same reference numeralsdenote the same constitution elements serving the same roles throughoutFIGS. 3A to 3F.

First, as shown in FIG. 3A, a first insulation layer 110 in which aplurality of first contact layers 111 are interposed in the firstinsulation layer 110 is formed over a substrate (not shown) providedwith a predetermined lower layer (not shown). Herein, the lower layermay include word lines, metal lines and metal plugs. Furthermore, thefirst insulation layer 110 is formed by using one selected from thegroup consisting of a high density plasma (HDP) oxide layer, aborophosphosilicate glass (BPSG) layer, a phosphosilicate glass (PSG)layer, a plasma enhanced tetraethyl orthosilicate (PETEOS) layer, aplasma enhanced chemical vapor deposition (PECVD) layer, a undopedsilicate glass (USG) layer, a fluorinated silicate glass (FSG) layer, acarbon doped oxide (CDO) layer, an organic silicate glass (OSG) layerand a combination thereof. Each of the first contact layers 111 canserve a role as a landing plug formed between the word lines.

Next, a second insulation layer 112 is formed over the first insulationlayer 110 including the first contact layers 111. Herein, the secondinsulation layer 112 is deposited by using the identical material usedto form the first insulation layer 110.

Next, a plurality of bit lines 113 are formed over the second insulationlayer 112. At this time, a plurality of capping layers 114 are formedover the bit lines 113 to protect the bit lines 113, and a plurality ofspacers 115 can be formed on sidewalls of the bit lines 113.

Next, a third insulation layer 116 is deposited over the above resultingstructure including the bit lines 113. Afterwards, the third insulationlayer 116 and the second insulation layer 112 are etched, therebyforming a plurality of first contact holes (not shown) exposing thefirst contact layers 111.

Next, a material having an etch selectivity different from the firstcontact layers 111 is deposited to fill the first contact holes andthen, a chemical mechanical polishing (CMP) process is performed.Through these steps, a plurality of second contact layers 117 buryingthe first contact holes are formed. Herein, the second contact layers117 are formed by using a material having an etch selectivity differentfrom the first contact layers 111. Thus, during a wet etching processsupposed to be performed subsequently, the second contact layers 117 areremoved; however, the first contact layers 111 are not etched butremain.

Next, as shown in FIG. 3B, an etch stop layer 118 is deposited over thethird insulation layer 116 including the second contact layers 117. Atthis time, the etch stop layer 118 is made of silicon nitride (SiN).

Next, as shown in FIG. 3C, a fourth insulation layer 119 is depositedover the etch stop layer 118. At this time, the fourth insulation layer119 is formed in a single layer or a stacked layer by using theidentical material used to form the first insulation layer 110.

Next, a hard mask 120 is formed over the fourth insulation layer 119. Atthis time, the hard mask 120 is formed by using a material having aphysical property identical to the second contact layers 117.

Next, as shown in FIG. 3D, a photoresist layer (not shown) is depositedover the hard mask 120 and then, a photoresist pattern 121 is formedthrough a photo exposure process and a developing process using aphotomask (not shown)

Next, an etching process 122 is performed by using the photoresistpattern 121 as an etch mask, thereby etching the hard mask 120 and thefourth insulation layer 119. At this time, the etching process isstopped once over a certain portion of the etch stop layer 118 and thus,a plurality of second contact holes 123 exposing the certain portions ofthe etch stop layer 118 can be formed through the etching process 122.

Next, a stripping process is performed, thereby removing a photoresistpattern 121, an etching process using a plasma method is performed,thereby removing the hard mask 120.

Next, by performing the etching process using the plasma method, theetch stop layer 118 exposed beneath bottom portions of the secondcontact holes 123 is etched.

Next, as shown in FIG. 3E, a wet etching process is performed, therebyetching the second contact layers 117 exposed due to the removal of theetch stop layer 118. Thus, a plurality of third contact holes 124exposing the first contact layers 111 are formed.

Next, as shown in FIG. 3F, a bottom electrode 125 of a capacitor isformed over an inner surface of each of the third contact holes 124(refer to FIG. 3E), and a dielectric layer 126 of a capacitor is formedover a height difference of the above resulting structure including thebottom electrodes 125. Thereafter, a top electrode 127 of a capacitor isformed over the dielectric layer 126 to bury the third contact holes124.

That is, in accordance with the first embodiment of the presentinvention, during the formation of the three dimensional typesemiconductor device, the first contact layers and the second contactlayers formed over the first contact layers are made of a differentmaterial having different etch selectivity from each other. Thus, duringthe wet etching process, the second contact layers are removed; however,the first contact layers remain. Also, the bottom electrode of thecapacitor is formed over the inner surface of the first to fourthinsulation layers formed over the first contact layers.

Accordingly, since a depth of the bottom electrode is increased as muchas a depth of each of the second contact layers compared to theconventional method, it is possible to increase an effective surfacearea of the capacitor. Accordingly, it is possible to secure a highcapacitance of the capacitor.

FIG. 4 is a microscopic image of scanning electron microscopy (SEM)illustrating the three dimensional type capacitor in accordance with thefirst embodiment of the present invention.

FIGS. 5A to 5F are cross-sectional views illustrating a method forfabricating a three dimensional type capacitor in accordance with asecond embodiment of the present invention. Herein, among referencenumerals illustrated in FIGS. 5A to 5F, the same reference numeralsdenote the same constitution elements serving the same roles throughoutFIGS. 5A to 5F. Furthermore, the second embodiment of the presentinvention is different from the first embodiment of the presentinvention only in which an insulation layer is not interposed between aplurality of bit lines and an etch stop layer. Accordingly, detailsillustrated in FIGS. 5A to 5F are briefly explained hereinafter.

First, as shown in FIG. 5A, a first insulation layer 210 in which aplurality of first contact layers 211 are interposed in the firstinsulation layer 210 is formed over a semiconductor substrate (notshown) provided with a predetermined lower layer (not shown). Herein,the lower layer may include word lines, metal lines, and metal plugs.

Next, a second insulation layer 212 is deposited over the firstinsulation layer 210 including the first contact layers 211, and aplurality of bit lines 213 are formed over the second insulation layer212. At this time, a plurality of capping layers 214 are formed over thebit lines 213 to protect the bit lines 213, and a plurality of spacers215 may be formed on sidewalls of the bit lines 213.

Next, a material having an etch selectivity different from the firstcontact layers 211 is formed over the second insulation layer 212including the bit lines 213 and afterwards, a chemical mechanicalpolishing (CMP) process is performed, thereby planarizing theaforementioned material. Accordingly, a plurality of second contactlayers 216 connected to the first contact layers 211 are formed betweenthe bit lines 213. Herein, since the second contact layers 216 areformed by using the material having an etch selectivity different fromthe first contact layers 211, during a wet etching process supposed tobe performed subsequently, the second contact layers 216 are removed;however, the first contact layers 211 are not etched, but remain.

Next, as shown in FIG. 5B, an etch stop layer 217 is deposited over theabove resulting structure including the second contact layers 216.

Next, as shown in FIG. 5C, a third insulation layer 218 and a hard mask219 are deposited over the etch stop layer 217.

Next, as shown in FIG. 5D, a photoresist layer (not shown) is depositedover the hard mask 219 and then, through a photo-exposure process and adeveloping process, a photoresist pattern 220 is formed.

Next, an etching process 221 using the photoresist pattern 220 as anetch mask is performed, thereby etching the hard mask 219 and the thirdinsulation layer 218. At this time, since the etching process 221 isstopped once over a certain portion of the etch stop layer 217, aplurality of first contact holes 222 exposing the certain portions ofthe etch stop layer 217 can be formed through the etching process 221.

Next, a striping process is performed, thereby removing the photoresistpattern 220 and an etching process using a plasma method is performed,thereby removing the hard mask 219.

Next, the etching process using the plasma method is performed, therebyetching the etch stop layer 217 exposed beneath bottom portions of thefirst contact holes 222.

Next, as shown in FIG. 5E, a wet etching process is performed and thus,the second contact layers 216 exposed due to the removal of the etchstop layer 217 are etched. Through these steps, a plurality of secondcontact holes 223 exposing the first contact layers 211 are formed.

Next, as shown in FIG. 5F, a bottom electrode 224 of a capacitor isformed over an inner surface of each of the second contact hole 223(refer to FIG. 5E), and a dielectric layer 225 of the capacitor isformed over a height difference of the above resulting structureincluding the bottom electrode 224. Thereafter, a top electrode 226 ofthe capacitor is formed over the dielectric layer 225 to bury the secondcontact holes 223.

As described above, in accordance with the present invention, during theformation of the three-dimensional type capacitor of the semiconductordevice, since the first contact layers and the second contact layersformed over the first contact layers are made of a material having anetch selectivity different from each other, the second contact layersare removed; however, the first contacts layer remain. The bottomelectrode of the capacitor is formed over the inner surface of theinsulation layers over the first contact layers. Accordingly, since adepth of the bottom electrode is increased as much as a depth of thesecond contact layer, it is possible to increase an effective surfacearea of the capacitor. Due to the increased effective surface area, itis possible to secure a high capacitance of the capacitor.

The present application contains subject matter related to the Koreanpatent application No. KR 2005-51344, filed in the Korean Patent Officeon Jun. 15, 2005, the entire contents of which being incorporated hereinby reference.

While the present invention has been described with respect to certainpreferred embodiments, it will be apparent to those skilled in the artthat various changes and modifications may be made without departingfrom the spirit and scope of the invention as defined in the followingclaims.

1. A method for fabricating a semiconductor device, comprising: forminga first insulation layer including a plurality of first contact layersover a substrate; forming a second insulation layer over the firstinsulation layer; forming a plurality of second contact layers by usinga material having an etch selectivity different from the first contactlayers such that the second contact layers are connected with the firstcontact layers within the second insulation layer; forming an etch stoplayer over the second insulation layer and the second contact layers;forming a third insulation layer over the etch stop layer; etching thethird insulation layer and the etch stop layer to form a plurality offirst contact holes exposing the second contact layers; etching theexposed second contact layers to form a plurality of second contactholes exposing the first contact holes; and forming bottom electrodesover the inner surface of the second contact holes.
 2. The method ofclaim 1, wherein a plurality of bit lines are interposed in the secondinsulation layer.
 3. The method of claim 2, wherein the secondinsulation layer is formed to cover the bit lines.
 4. The method ofclaim 1, further comprising forming a hard mask over the thirdinsulation layer.
 5. The method of claim 2, further comprising forming ahard mask over the third insulation layer.
 6. The method of claim 4,wherein the hard mask includes a material having a physical propertysubstantially identical to that of the second contact layers.
 7. Themethod of claim 5, wherein the hard mask includes a material having aphysical property substantially identical to that of the second contactlayers.
 8. The method of claim 1, wherein the first contact layers servea role as a landing plug.
 9. The method of claim 2, wherein the firstcontact layers serve a role as a landing plug.
 10. A method forfabricating a semiconductor device, comprising: forming a first stackstructure over a substrate including a plurality of first contactlayers; forming a plurality of first openings inside the first stackstructure such that the first openings expose the first contact layers;forming a plurality of second contact layers in the first openings;forming a second stack structure over the second contact layers and thefirst stacked structure; etching the second stack structure using apattern as a mask to expose the second contact layers; etching theexposed second contact layers to form second openings exposing the firstcontact layers; and forming bottom electrodes over the inner surface ofthe second openings.
 11. The method of claim 10, wherein the first stackstructure includes a plurality of insulation layers.
 12. The method ofclaim 11, wherein a plurality of bit lines are interposed in theinsulation layers.
 13. The method of claim 10, wherein the second stackstructure includes a hard mask.
 14. The method of claim 13, wherein thehard mask is formed using a material having a physical propertysubstantially identical to that of the second contact layers.
 15. Themethod of claim 10, further comprising planarizing the second contactlayers after forming the second contact layers in the first openings.16. The method of claim 15, further including forming an etch stop layerafter the planarizing of the second contact layers.
 17. The method ofclaim 10, wherein the first stack structure includes a first insulationlayer, bit line structures formed over the first insulation layer, and asecond insulation layer over the bit line structures, and the individualbit line structure includes a bit line, a capping layer over the bitline, and a spacer surrounding the capping layer.
 18. The method ofclaim 10, wherein the second stack structure includes an etch stoplayer, an insulation layer, and a hard mask.
 19. The method of claim 10,wherein the second contact layers includes a material having an etchselectivity different from the first contact layers.
 20. A semiconductordevice, comprising: a first stack structure over a substrate including aplurality of first contact layers; a plurality of first openings in thestack structure such that the first openings expose the first contactlayers; a plurality of second contact layers formed in the firstopenings; a second stack structure over the second contact layers andthe first stack structure; a plurality of second openings exposing thefirst contact layers; and a plurality of bottom electrodes over theinner surface of the second openings.
 21. The semiconductor device ofclaim 20, wherein the first stack structure includes a first insulationlayer, bit line structures formed over the first insulation layer, and asecond insulation layer over the bit line structures, and the individualbit line structure includes a bit line, a capping layer over the bitline, and a spacers surrounding the capping layer and the bit line. 22.The semiconductor device of claim 20, wherein the second stack structureincludes an etch stop layer, an insulation layer, and a hard mask. 23.The semiconductor device of claim 20, wherein the second contact layersinclude a material having an etch selectivity different from the firstcontact layers.